Based on the search results, the available information focuses on the definition of Moore's Law, its historical impact, the ongoing challenges to maintaining its pace, and related economic principles. No direct information about a recent, successful "revival" of Moore's Law is presented in these results.

⚙️ The Ongoing Challenge to Moore's Law

Moore's Law is the observation that the number of transistors on an integrated circuit doubles approximately every two years, driving exponential growth in computing power . However, this pace has been under sustained pressure for years due to two key factors:

· Physical Limits: Shrinking transistors to atomic scales presents extreme physics and engineering challenges .

· Economic Limits - "Rock's Law": The cost of building cutting-edge semiconductor fabrication plants (fabs) rises exponentially, now exceeding $10-20 billion per facility . This makes the necessary investments astronomical and riskier.

Despite these challenges, major industry players are actively innovating to extend the progress of computing power, though they are doing so in ways that have evolved beyond simply cramming more transistors onto a single chip.

🔬 Key Innovations Extending Computing Progress

1. Advanced Transistor Architectures

· From FinFET to GAAFET: To maintain control over ever-smaller transistors, the industry is transitioning from FinFET structures to Gate-All-Around (GAAFET) designs, which provide better electrical control .

· Intel's RibbonFET: Intel is introducing its version of GAAFET, called RibbonFET, as part of its roadmap to advance transistor technology .

2. Innovations in Semiconductor Materials

Research is ongoing into novel materials,such as those just three atoms thick, to enable continued transistor scaling .

3. System-Level Innovations

A major shift in approach is to augment transistor scaling with architectural and packaging breakthroughs:

· Advanced Packaging (e.g., 2.5D, 3D): Technologies like Chiplets and 3D stacking allow multiple smaller chips (chiplets) to be packaged tightly together, acting as a single, more powerful system. This improves performance and energy efficiency without relying solely on making a single chip smaller .

· Design-Technology Co-Optimization (DTCO): The industry now focuses on optimizing chip design and manufacturing processes together to extract maximum performance gains from new process nodes .

🏢 Industry Structure & Economic Dynamics

To manage the astronomical costs of fabrication (Rock's Law), the industry has evolved into a highly specialized ecosystem:

· The Foundry Model: Companies like TSMC and Samsung operate as "foundries," manufacturing chips for many "fabless" design companies (like Nvidia, Qualcomm, and Apple) . This allows them to spread the massive cost of fabs across multiple clients.

· High-Stakes Competition: Staying at the cutting edge requires reinvesting 40-60% of revenue into capital expenditures and R&D . Falling behind even one technology generation can be devastating, creating a relentless competitive cycle.

💎 Summary and Current Outlook

In short, while the literal, original trajectory of Moore's Law has slowed, the semiconductor industry has not stopped advancing. Progress is now driven by a combination of:

· Continued, but more difficult, transistor miniaturization

· New transistor structures (like GAAFET/RibbonFET)

· Revolutionary packaging techniques (like 3D integration and chiplets)

Leading companies such as Intel, TSMC, and Samsung are pursuing these paths and have expressed confidence in maintaining a Moore's Law-like pace of improvement for the foreseeable future through these innovations .

If you are interested in a specific company's roadmap or a particular technology like chiplets, I can search for more detailed information on that topic.