This is a deep dive into the entire AI infrastructure supply chain. I've organized the supply chain by tiers and labeled the corresponding Chinese names and stock codes. The wealth codes are all here!
AI infrastructure entire industry chain map. This map showcases a complete loop from upstream substrate materials to laser light sources, then to optical module interconnections, ultimately leading to AI computing platforms and physical AI (robots).
1. Top-tier: Substrate materials (red nodes)
GaAs (Gallium Arsenide), InP (Indium Phosphide) and other compound semiconductors are the source of optical communications.
AXT ($AXTI): AXT Inc. from the US
JX Metals (TYO: 5765): JX Metals Japan
Sumitomo Electric (TYO: 5802): Sumitomo Electric Industries
New Optical (TSE: 2455): New Optical
Wangxi (TSE: 6223): Wangxi Technology
II. Epitaxy Layer (Orange Node)
Thin film growth on substrates is key to optical chip performance.
Oclaro (TSE: 3081): Oclaro
IQE (London: $IQE): IQE PLC
III. Lasers/EML (Deep Red Node)
The hub of the supply chain, crucial for optical signal quality.
Sivers Semiconductors (Stockholm: $SIVE / OTC: SIVEF): Sivers Semiconductors
Coherent (NASDAQ: $COHR): Coherent Inc.
Lumentum (NYSE: $LITE): Lumentum Holdings
MACOM (NASDAQ: $MTSI): MACOM Technology
IV. Optical Modules and Optical Interconnect (Blue Node)
Encapsulating lasers into high-speed modules for data centers.
Zhongji Xuchuang (SSE: 300308): Zhongji Xuchuang
New Ease (SSE: 300502): New Ease
Furukawa Electric (TYO: 5801): Furukawa Electric Industry
Fabrinet (NYSE: $fn): Fabrinet
Marvell (NASDAQ: $MRVL): Marvell Technology
V. Silicon Photonics/Optical Computing (Purple Node)
Pioneers of next-generation interconnect technology.
POET Technologies (NASDAQ: $POET): POET Technologies
X-FAB (Europe: $XFAB): X-FAB Silicon Wafer Foundry
Alphawave/OpenLight (NYSE: $AWE): Alphawave IP
Caiyu Technology (TSE: 6789): Caiyu Technology
Qualcomm (NASDAQ: $QCOM): Qualcomm Inc.
VI. Storage and Advanced Packaging (Blue Node)
Essential support for computing chips, solving memory wall issues.
SK Hynix (KRX: 000660): SK Hynix
Micron (NASDAQ: $MU): Micron Technology
Samsung Electronics (KRX: 005930): Samsung Electronics
Unimicron Technology (TSE: 3037): Unimicron Technology
ASE Technology (TSE: 3711 / NYSE: $ASX): ASE Technology Holding
Hon Hai (TSE: 2317): Hon Hai Precision (Foxconn)
VII. Semiconductor Equipment (Gray Block)
Covering the entire manufacturing process including detection, lithography, and bonding.
Advantest (JP: 6857 / NYSE: $ATEYY): Advantest
ASMPT (HKEX: 0522): ASMPT
Aixtron (DE: $AIXA): Aixtron
Veeco (NYSE: $VECO): Veeco
Wentai Technology (SSE: 600745): Wentai Technology
VIII. AI Computing Platforms (Core Black Node)
The command center of the AI ecosystem.
NVIDIA (NYSE: NVDA): NVIDIA
Google (NASDAQ: GOOGL): Google
Apple (NASDAQ: AAPL): Apple Inc.
Intel (NASDAQ: INTC): Intel
Broadcom (NASDAQ: AVGO): Broadcom Inc.
AMD (NASDAQ: AMD): Advanced Micro Devices
Amazon (NASDAQ: AMZN): Amazon
Meta (NASDAQ: META): Meta Platforms
Microsoft (NASDAQ: MSFT): Microsoft
Oracle (NYSE: ORCL): Oracle
MediaTek (TSE: 2454): MediaTek
WorldChip (TSE: 3661): WorldChip-KY
Vertiv Technologies (NYSE: VST): Vertiv Technologies (Power Facilities)
Constellation Energy (NYSE: $CEG): Constellation Energy (Power Facilities)
IX. Foundries/Specialty Wafer Fab (Green Node)
Tower Semiconductor (NASDAQ: TSEM): Tower Semiconductor
Soitec (FR: $SOI): Soitec
GlobalFoundries (NASDAQ: $GFS): GlobalFoundries
X. Robotics/Physical AI (Pink/Magenta Node)
AI's terminal applications entering the physical world.
Tesla (NYSE: TSLA): Tesla
Allegro MicroSystems (NASDAQ: $ALGM): Allegro MicroSystems
MP Materials (NYSE: $MP): MP Materials
Ouster (NYSE: $OUST): Ouster
Ambarella (NASDAQ: $AMBA): Ambarella
Vicor (NYSE: VICR): Vicor Corporation
Novanta (NASDAQ: NOVT): Novanta
Harmonic Drive (JP: 6324): Harmonic Drive
Lattice Semiconductor (NASDAQ: LSCC): Lattice Semiconductor
Sanhua Intelligent Control (SSE: 002050): Sanhua Intelligent Control
Summary of core supply chain logic
The core logic chain of the entire diagram is:
Compound substrates/epitaxy → Optical chips/lasers (Hub: Sivers) → Optical modules → Computing platforms (NVIDIA/Google) → Physical AI terminals (Tesla/Optimus)
Parallel Collaboration: Storage (HBM) and advanced packaging (CoWoS) support the ultimate output of computational performance.
Manufacturing Support: Semiconductor Equipment is Key.
Power Assurance: Data center power supply (VST/CEG) is the last line of defense for computational expansion.