hightechnews

OpenAI's CEO Sam Altman is set to meet with Samsung Electronics' management (KS:005930) next week during his visit to South Korea, where the discussion will focus on the company's efforts to integrate artificial intelligence into its operations, reported Yonhap on Thursday.

Illinois Governor J.B. Pritzker plans to temporarily halt the review of tax break applications for data centers (DCs) looking to set up shop in the state, reports NBC News. The pause will take effect on July 1 and is part of efforts to draft new regulations for these types of facilities.

Broadcom's stock tanked a staggering 15.9% from yesterday's close, hitting $403.01. The company's market cap dropped by over $300 billion in just one day. This marks one of the largest single-day plummets in the history of the U.S. stock market, according to the Financial Times. The crash happened after the company stuck to its previous AI revenue forecast for 2027 ($100 billion) without any upward revision, despite investors expecting a more bullish update. Meanwhile, the financial results beat consensus estimates.

Samsung Electronics dropped some big news at Computex 2026 in Taiwan, unveiling their HBM5 tech. This fresh gear features a thermal management system called HPB, along with some serious production breakthroughs for next-gen memory chips.
The HPB technology employs a chimney-like thermal structure that cuts down thermal resistance between the chips. It channels heat away from the main die and base die through specialized heat-dissipating columns, directing it to a heat spreader at the top of the package or outside it. Samsung claims this method allows for heat dissipation without complicating the design of the HBM main dies or the stacking layout of HBM.